As part of a leading global semiconductor group, Silicon
Microstructures works closely with all members of the MEMS value
chain to provide the market with the highest standards of value and
reliability. Moreover, our commitment to designing, testing and
producing quality MEMS devices not only extends to established
technology companies, but also to new entrants to the MEMS industry
as well.
Given our role within the MEMS community, we invite all
participants within the semiconductor field to work with SMI on
innovative projects, prototypes to volume production, whether
affiliated with a venture capital team, industry trade group,
academic institution, governmental agency, or corporate entity.
Ultra-Small Pressure Sensor
The SM5108 is an ultra-small absolute pressure sensor for
extremely size-sensitive high-volume applications. Over 24,000 die
are available on one 150 mm wafer. As such, this die is ideally
suited where yearly demand is over 2.5 million pieces. The die, as
sawn, measures 0.65 mm x 0.65mm and is available in pressure ranges
from 15 PSI to 150 PSI. Custom configurations can be made available
as well -- please consult SMI sales for details.
Co-Integrated Digital Pressure Sensor
A single-chip pressure sensor, fabricated by means of a process
flow compatible with standard CMOS and MEMS technology, combines
all the analog and digital signal conditioning and pressure-sensing
functions on the same chip, including the temperature and linearity
correction required by the automotive industry. Featuring analog
and digital signal output, this co-integrated design offers
superior performance while reducing size compared to hybrid
configurations. On-chip EEPROM stores the calibration and
compensation values, and test results show a dramatic improvement
in device perfomance over the uncompensated result. All current
SM58xx products are based on this amplification and digital signal
processing platform.
Ultra-Low Pressure Sensor
A new structure based on a two-step micro-machining process
allowed to extend the range over which piezoresistive sensors can
operate towards ultra-low pressures <50 kPa. Central to this
approach is mechanical stress concentration based on a "bossed"
structure with a suspended rigid area in the center of the
diaphragm. The moveable surface deflects like a piston deformable
plate. This allows force concentration and improved linearity.