Pressure Converter
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Uncompensated

The same die used in our compensated systems are available as packaged sensor die without compensation. The customer can implement their own temperature compensation scheme with easy-to-use standard JEDEC packages. These are the same highly stable sensors used in the AccuStableTM line of compensated devices. A variety of porting options are available.

 

 

Uncompensated Low Pressure (SM9G/D)
Silicon Microstructures provides its most popular pressure sensor die in a surface mount small outline package (SO-16) configuration. All parts in this series are uncompensated high performance die mounted in an injection-molded package designed for surface mounting.

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Medium Pressure Sensor (SM5G/D)
The GGG Series is a small outline SO-8 packaged pressure sensor that incorporates SMI’s new SM30G MEMS piezoresistive pressure sensing die. The GGG Series has been optimized to provide the highest possible accuracy for a package of this size. Performance is achieved through careful resistor placement and mechanical configuration along with advanced MEMS processing.

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Absolute Pressure Sensor (SM5420)
The SM5420E is a small outline SO-8 packaged pressure sensor that incorporates SMI’s new SM5108E MEMS piezoresistive pressure sensing die. The SM5420E has been optimized to provide the highest possible stability for a package of this size. Performance is achieved through careful resistor placement and mechanical configuration along with advanced MEMS processing.

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Absolute Pressure Sensor (SM6841)
The SM6841 is a small outline SO-8 packaged pressure sensor that incorporates SMI’s SM5108C MEMS piezoresistive  pressure sensing die. The SM6841 has been optimized to provide the highest possible accuracy for a package of this size. Performance is achieved through careful resistor placement and mechanical configuration along with advanced MEMS processing.

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