MEMS Die

For customers who want complete control over packaging and signal conditioning, SMI offers sensor die. These are typically delivered as sawn wafers on tape, but other options include picked die in waffle packs or Gel-PakTM boxes. Sensor die are fully inspected and electrically probed before delivery.

 Customized die options include:

  • Backside Gold for eutectic bonding
  • Top-side Gold or Platinum for harsh media
  • Wafer Thinning for die stacking
  • Solder bumping
  • Open or closed bridge designs

     

Ultra Low Pressure Die | SM95D/G

The SM95D/G is a silicon micro-machined, piezoresistive pressure sensing die. This device is available with a full-scale range of 0.15 to 1.50 PSI (1.0 to 10 kPa) and is ideal for OEM and high-volume applications.

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Medium Pressure Die | SM30D

The SM30D is a silicon micro-machined, piezoresistive pressure sensing die. This device is available with a full-scale range of 5 to 150 PSI.

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Absolute Pressure Die | SM5108E

The SM5108E is an all silicon micro-machined, piezoresistive pressure sensing chip. The die is extremely small (0.69 mm x 0.69 mm) and has been optimized to provide the highest possible accuracy for a die of this size.

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Backside Ultra High Pressure Harsh Media Die | SM98A

TheSM98A is a silicon micro-machined, piezoresistive pressure-sensing chip. The SM98A is designed for harsh media where absolute pressure needs to be accurately measured.

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Backside High Pressure Harsh Media Die | SM99A

The SM99A is a silicon micro-machined, piezoresistive pressure-sensing chip. The SM99A is designed for harsh media where absolute pressure needs to be accurately measured.

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